Silicon - Silicon anodic-bonding with intermediate glass layers using spin- on glasses - Micro Electro Mechanical Systems, 1996, MEMS '96, Proceedings. 'An Investigation of Micro Structur
نویسنده
چکیده
This paper presents for the first time the preparation of glass layers, suitable for the anodic bonding of two silicon substrates using a spin-on glass. In this process a liquid sol solution is used within a spin coating process. The solution is a mixture based on silica sol, organic silicon containing compounds, like TEOS (Tetraethylorthosilicate), and a sodium salt all dissolved in ethanol. After a careful thermal treatment, silica films containing up to 5 5% wt. N a 2 0 (sodium oxide) can be obtained with a thickness in the range from 600 nm to 1000 nm in one deposition step. The spinon glass films are very smooth. Anodic bonding of two silicon substrates is possible with all films either prepared at temperatures of 420"C, 540°C or even higher.
منابع مشابه
Analytical Approach for Vibration Analysis of a Microsensor with Two layers of Silicon and Piezoelectric based on MCST
The vibration analysis is an important step in the design and optimization of microsensors. In most of the cases, COMSOL software is employed to consider the size-dependency on the dynamic behavior in the MEMS sensors. In this paper, the Modified Couple Stress Theory (MCST) is used to capture the size effect on dynamic behavior in a microsensor with two layers of the silicon and piezoelectric. ...
متن کاملA MEMS thermal shear stress sensor produced by a combination of substrate-free structures with anodic bonding technology
By combining substrate-free structures with anodic bonding technology, we present a simple and efficient micro-electro-mechanical system (MEMS) thermal shear stress sensor. Significantly, the resulting depth of the vacuum cavity of the sensor is determined by the thickness of silicon substrate at which Si is removed by anisotropic wet etching process. Compared with the sensor based on a sacrifi...
متن کاملDesign and Analysis of a Novel MEMS Dual Axis Accelerometer
Due to their small size, low weight, low cost and low energy consumption, MEMS (Microelectromechanical Systems) devices have achieved great commercial success in recent decades. MEMS accelerometers have been widely used in automobile airbag deployment systems, inertial navigations, etc. In this paper, the design and simulation of a novel bulk-micromachined capacitive MEMS dual axis acceleromete...
متن کاملImplementation of silicon-on-glass MEMS devices with embedded through-wafer silicon vias using the glass reflow process for wafer-level packaging and 3D chip integration
This study presents a novel system architecture to implement silicon-on-glass (SOG) MEMS devices on Si–glass compound substrate with embedded silicon vias. Thus, the 3D integration of MEMS devices can be accomplished by means of through-wafer silicon vias. The silicon vias connecting to the pads of devices are embedded inside the Pyrex glass. Parasitic capacitance for both vias and microstructu...
متن کاملDesign, Analysis and Experiment of MEMS based Micropump by a Piezoelectric stack actuator for bio-medical Application
In this paper, we present the design, analysis and fabrication of MEMS based silicon micro-needles for insertion of fluid into the dermis and subcutaneous fat layer of human skin. Micro-electromechanical systems (MEMS) are uncovered to an assortment of liquid environments in applications such as chemical and biological sensors and microfluidic devices. In this paper, the design and fabrication ...
متن کامل